Program Management Lead - SoC Execution and Customer Engagements

About TylSemi, Inc. The Opportunity The AI infrastructure market is exploding. Every hyperscaler, every cloud provider, every AI company is building custom silicon. But they all face the same problem: how do you connect hundreds of chips, deliver clean power at scale, and move terabits of data without melting the package? That's what we solve. TylSemi builds the chiplet infrastructure IP — the IO, power delivery, and interconnect building blocks — that makes AI/HPC systems actually work at scale. This isn't a nice-to-have. It's the critical path. Why Now The Market Window The semiconductor industry is going through its biggest architectural shift in 40 years: • Moore's Law is dead. 2nm and beyond delivers marginal performance gains. The future is chiplets, not monolithic dies. • Custom silicon is now mainstream. Google, Microsoft, Amazon, Meta, OpenAI — they're all designing their own ASICs. The $50B custom silicon market is growing 30% annually. • IO and power are the bottleneck. Solve hard problems and provide something which is a category in itself. Translation: We're entering the market at exactly the moment when every major AI/HPC player needs what we're building, and their alternatives are disappearing. Culture & Team: How We Work No Politics, No Bureaucracy There are no layers, no approval chains, no corporate theater. • If you have an idea, we test it. If it works, we ship it. • No endless meetings, no PowerPoint presentations to convince middle management. Remote-Friendly, Global Team • US team: Bay Area preferred, but we hire the best people regardless of location • India team: Building a world-class design center in Bangalore Move Fast, Ship Real Products We're not a research project. We have paying customers, committed capital, and aggressive timelines. This is a company, not a lifestyle business. We're building to win. What We Value • Ownership mindset. You're not here to execute someone else's roadmap. You're here to define it. • Bias for action. We move fast. Analysis paralysis doesn't fly here. • Deep technical expertise. This is hard engineering. We need people who've shipped real silicon and debugged real hardware. • Low ego, high standards. We don't care about titles or politics. We care about results. The Ask If you're reading this, you're probably comfortable. You have a good job at a stable company with all the benefits. We're asking you to walk away from that and bet on us. Here's why you should: • The market is real. AI infrastructure spending is $200B+ annually and growing 40% YoY. Every hyperscaler needs what we're building. • The team has done this before. We've built and exited semiconductor companies at scale. This isn't our first rodeo. • The traction is de-risked. We have LOIs, strategic investors, and a clear path to revenue. • The work is consequential. You're not optimizing someone's ad click-through rate. You're building the silicon infrastructure that powers AI. This is the bet. Join us and build something that matters. Or stay comfortable. No judgment. But if you're the kind of person who wants to take the shot, we'd love to talk. READY TO JOIN? About the role TylSemi is looking for a Program Management and Execution Leader who can sit at the intersection of SoC execution, silicon realization, and customer success. You will own the operational thread that connects our stretagic initiatives to customers and SoC execution — making sure every engagement moves with precision from idea to silicon. This is a high-visibility, high-ownership role at a company in its earliest and most consequential stage. You will work directly with founders, customers, the leading semiconductor ecosystem players. No layers, no ambiguity about impact. What you'll do Manage all active customer engagements end-to-end: from architectural spec alignment through tape-out, KGD testing, packaging, and volume shipment milestones Ensure alignment with ecosystem partners — including foundries, OSAT/packaging houses, EDA vendors (Synopsys, Cadence), and IP partners Translate customer requirements (silicon architecture, interface specs, package form factor, delivery schedules) into internal program plans with clear owners and dates Build and maintain program trackers, risk registers, and executive dashboards covering each engagement Drive gate reviews and weekly program syncs across internal RTL/DV, physical design, and validation teams Manage internal and external scoping and delivery timelines in coordination with technical and business teams Identify and escalate risks early; propose and implement mitigations before they become schedule threats What you bring 15+ years of technical program or project management experience in semiconductor, custom silicon, or chiplet/advanced packaging environments Direct experience interfacing with ecosystem partners — chip development schedules, interdepencies on EDA and IP, tape-out schedules and silicon bringup timelines Familiarity with silicon fabrication, advanced packaging formats: CoWoS, InFO, 2.5D/3D integration, substrate/interposer-based assembly Technical fluency in SoC or chiplet design flows — enough to understand RTL milestones, DV sign-off, PD handoffs, and silicon bring-up phases without needing translation Strong communication skills — comfortable presenting program status and risk posture to internal and external stakeholders Proficiency with program tracking tools (and spreadsheet-based trackers); experience building program infrastructure from scratch is a plus Familiarity with key connectivity IPs UCIe, PCIe Gen 5/6/7+, or high-bandwidth D2D interconnect standards is a strong plus Nice to Have to Shine Prior experience at a chiplet startup, merchant silicon company, or systems company Background in AI/ML infrastructure silicon — accelerators, network switches, CPO-enabled platforms Familiarity with IVR/PMIC integration challenges in advanced packaging Exposure to EDA infrastructure programs (SNPS/CDNS cloud flows)