Module Process Engineer Director - (E6)

Who We Are Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world. What We Offer Salary: $0.00 - $0.00 Location: Albany,NY You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits . Module Process Integration Engineering Director needed to explore and build novel devices and modules in derivative and specialty market technology segments. Hands-on experience in semiconductor and packaging process environments is preferred. An understanding of the relationships between device design, material physics and functional characterization is ideal. A passionate drive, a curious mind and adaptable spirit are expected. This role demands a clear, organized and thoughtful communicator who is willing to collaborate with external customers seeking to leverage the process capability of Applied Materials to solve their complex, real world challenges. Qualities: Solves complex problems; takes a broad perspective to identify innovative solutions. Works independently, requiring minimal guidance. Will work with cross-functional teams on projects. Required Skills Demonstrated experience in integration of integrated devices in FEOL & BEOL processing and wafer level packaging. Experience in end to end technology development including: process assumptions, ground rule generation, test site coordination and tape out, test site scheduling, setup and installation, route pipe cleaning, wafer processing logistics, test and characterization and process debug. Demonstrate understanding of measurement techniques used to characterize physical and electrical properties of materials, with demonstrated experience in at least one technique. Working understanding of various semiconductor devices, such as Diodes, Transistors, MOS, MIM etc. Working understanding of the relationship between a device’s design, material composition and its functional behavior. Working Understanding of techniques commonly used to characterize integrated device structures, such as, but not limited to, reliability, construction analysis, and/or functional circuit characterization, is preferred. Enjoys working in team-oriented, collaborative environments. Key Responsibilities Conceive, design, execute and analyze experiments to demonstrate viability and scalability of proof-of-concept devices. Identify key metrics, prepare project plans and drive multi-party collaborations from conception to implementation. Will participate in the development of strategies, processes and resources. Participates on multifunctional design teams comprised of internal, external and/or matrixed headcount to complete projects. Provides technical input to team members to achieve project goals. Communicate and report status in a clear and organized fashion, tailoring message as needed to their audiences such as peers, management, leadership and clients. Identifies and resolves potential complications within the project, and develops solutions for resolution. Functional Knowledge Understanding of how to develop, integrate and scale processes for device fabrication. Business Expertise Will question and challenge assumptions and practices used to improve products, processes or services Leadership Will take initiative to support functional teams or projects with moderate resource requirements, risk, and/or complexity Problem Solving Uses analytical approach to make decisions and identify innovative solutions Impact Impacts the achievement of customer, operational, project or service objectives; work is guided by functional policies and directed by leads and managers. Interpersonal Skills Communicate concepts and negotiate with others to adopt a different point of view Strong presentation and oratory skills for both internal team, executive communication, and external customer presentations. Additional Information Time Type: Full time Employee Type: Assignee / Regular Travel: Yes, 10% of the Time Relocation Eligible: Yes The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable. For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement. Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law. In addition, Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at [email protected], or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.