Principal Hardware Development Engineer - Signal Integrity

Join Nokia's Optical Networks Hardware team and play a key role in shaping next-generation high-speed optical transport platforms. As a Principal Hardware Development Engineer specializing in Signal Integrity, you will drive the design, simulation, validation, and optimization of high-speed interconnects and printed circuit boards supporting advanced 800G and future 1.6T optical networking solutions. Working closely with hardware, PCB layout, mechanical, firmware, and optical engineering teams, you will help ensure industry-leading performance, reliability, and scalability of cutting-edge networking products. Your expertise will contribute directly to the successful delivery of high-speed systems that power the world's critical communications infrastructure. NILightpath Lead signal integrity analysis for high-speed PCB and system designs. Perform pre-layout and post-layout SI/PI simulations and validation. Define PCB stack-ups and select appropriate laminate materials. Analyze S-parameters, eye diagrams, crosstalk, jitter, and COM metrics. Develop and validate models for connectors and complex interconnect structures. Collaborate with cross-functional teams to optimize system performance. Support laboratory correlation using VNA, TDR, and related measurements. Drive SI best practices and technical innovation across development programs. Must Have Bachelor's degree or higher in Electronics, Electrical Engineering, or related field. 12+ years of signal integrity engineering experience. Strong knowledge of PCB technologies, construction, and design constraints. Expertise with SI simulation tools such as ADS, HFSS, or equivalent. Experience using measurement equipment including VNA and TDR. Proven expertise in PCB stack-up design and material selection. Strong understanding of high-speed signaling fundamentals and channel behavior. Experience with SI/PI simulations and analysis of eye opening, crosstalk, jitter, and COM. Nice to Have Experience with optical module design, including QSFP-DD and OSFP. Knowledge of 112G and 224G PAM4 signaling technologies. Understanding of RF design techniques and structures. Familiarity with EMI/EMC analysis and mitigation. Experience with PCB-level hardware design and debugging. Knowledge of signal quality impairments such as jitter and wander. Ability to navigate technical challenges within dynamic supply-chain environments.