Process Integration Engineer – Power Semiconductor Technology

About EpinovaTech

EpinovaTech is a fabless semiconductor startup collaborating with partners across Europe to develop a new class of GaN-on-Si power switches for automotive, AI data center, solid-state transformer, and energy distribution applications.

Your Role

EpinovaTech is seeking an experienced Process Integration Engineer to develop and industrialize BEOL processes for our vertical GaN power devices. A key focus will be to take our initial backside-contact concept through development and validation to a manufacturable foundry process, while ensuring compatibility with subsequent power-module integration. As part of a small, experienced team, you will be expected to work independently, take complete responsibility for your work, and contribute across a broad range of technical challenges.

Key Responsibilities Include

• Process Development and Integration: Drive backside-contact and broader BEOL process development, including temporary wafer bonding/debonding, wafer thinning and backside preparation, metallization, thermal processes, and wafer singulation. Define characterization needs and translate results into process decisions.
• Materials and Interfaces: Guide process and material choices based on an understanding of material interfaces, adhesion, mechanical and thermal behavior, electrical contact formation, and power-module integration.
• Industrialization: Drive BEOL development with our foundry and external technology partners toward robust, scalable manufacturing.

This is a fully remote position, with occasional travel within Europe (approximately six to ten times

per year) for partner meetings.

What We Expect

• Degree in materials science, semiconductor engineering, physics, electrical or mechanical engineering, or a related field.
• 5+ years of experience in semiconductor process development, process integration, wafer fabrication, and advanced packaging.
• Strong understanding of materials science and interfaces, combined with practical experience in BEOL and backside processes such as temporary wafer bonding/debonding, wafer thinning, surface preparation, metallization, annealing, and wafer singulation.
• Familiarity with power-semiconductor die-attach and interconnect technologies such as sintering, ribbon bonding, and copper-clip interconnects.
• An ownership-oriented mindset with strong analytical and coordination skills.

Why Join Us?

At EpinovaTech, you will have the opportunity to take ownership of a critical part of bringing a new vertical GaN power-device technology from development toward industrial manufacturing. This is a role with substantial technical responsibility and direct impact, working across semiconductor process development, materials, and manufacturing industrialization in a fast-moving startup environment. You will work closely with an experienced international team and external technology partners to bring our vertical GaN technology toward scalable industrial manufacturing using established semiconductor processes and equipment.