Senior Advanced Packaging Engineers / Solution Architects – IC & Photonics |

Package design · Photonic integration · Assembly · Prototype to production.

Shape the next generation of semiconductor and photonic packaging, from design and integration to industrial production.

Location: Europe, with opportunities involving the US

Work setup: Hybrid or remote, with regular travel across Europe

Engagement: Interim, freelance or permanent

Compensation: Excellent package, based on experience and engagement type

Konexion is looking for experienced advanced packaging professionals for international projects spanning ICs, photonics and opto-electronic systems. You will help develop packaging solutions that meet demanding electrical, optical and thermal requirements while remaining practical to assemble, scale and manufacture.

Your work may take you from early package architecture and simulation through prototype validation to assembly planning and production ramp-up. You will collaborate with design teams, researchers, customers and assembly partners, connecting technical decisions with project and commercial goals.

• Define and evaluate package architectures for advanced IC and photonic applications, including 2.5D, 3D and hybrid integration.
• Improve electrical and optical performance, with attention to signal integrity, power integrity, EMC, interconnects, coupling and thermal behaviour.
• Develop practical integration and assembly approaches for chips, photonic integrated circuits and opto-electronic components.
• Work with internal teams and external partners on package development, prototyping, testing and qualification.
• Assess trade-offs between performance, reliability, yield, manufacturability and cost.
• Support the transition from prototype to production, including package selection, assembly planning and coordination with manufacturing partners.
• Document design choices, simulation results, validation outcomes and recommendations for customers and project teams.
  

• A master’s degree or PhD in electronics, electrical engineering, photonics, physics, mechanical engineering or a related field.
• At least five years of relevant experience in semiconductor packaging, photonics packaging, assembly or opto-electronic integration.
• Deep expertise in at least one of these areas: IC package design and SI/PI analysis; laser and PIC packaging; or package development and assembly from prototype to production.
• An understanding of how packaging choices affect performance, reliability and manufacturability.
• The ability to take ownership, work across disciplines and communicate technical decisions clearly in English.

Experience with Cadence, Ansys, mechanical CAD, III–V laser integration, optical coupling, high-speed interconnects or advanced backend processes is valuable, depending on your specialisation. We do not expect every candidate to bring all of these skills.

You will work on ambitious semiconductor and photonics projects in an international R&D and industrial environment. Assignments may involve teams and partners in the Netherlands, Belgium, Germany and Spain, as well as the US.

The working arrangement can be hybrid or remote, with regular travel where collaboration or project delivery requires it. Hands-on packaging, lab and validation activities will involve time on site. We offer excellent earning potential and can discuss interim, freelance and permanent options.

At Konexion, we connect specialists with opportunities that match their expertise, ambitions and preferred way of working.

Apply, Looking forward to getting Konnected!

Independent professionals, contractors and other experienced interim specialists are invited to apply. The contractual arrangement will be structured through Konexion in accordance with the client’s procurement and compliance requirements.

At Konexion, talented professionals are at the heart of everything we do. Whether you join our team, work with one of our clients through Konexion, or collaborate with us as an independent professional, we connect you with assignments that match your experience and ambitions.