IC Design Lead – ROIC Architecture & Infrared Imaging | Relocation possible

For our client, one of Europe’s fastest-growing advanced imaging technology companies, we are looking for an experienced IC Design Lead to shape the next generation of infrared camera technology.

You will develop the read-out ICs (ROICs) at the heart of high-performance imaging systems used in demanding aerospace, defence, industrial, research and security applications. This is a rare opportunity to combine deep analog/mixed-signal IC design with technology where image quality, noise, speed and reliability truly matter.

Please note: The company is willing to support a relocation / visa process for this role.

Your role

As the technical owner of complete ROIC development projects, you will define the top-level ROIC architecture for infrared image sensors and guide it from initial concept through tape-out and silicon validation.

You will work hands-on while providing technical direction to internal IC engineers and external design partners. Working closely with the IC Layout Lead and Project Manager, you will ensure that each chip meets its technical targets and is delivered successfully.

What you will do

• Own the technical development and delivery of high-performance ROICs for infrared imaging sensors
• Define the top-level readout architecture, circuit specifications and key technical trade-offs around noise, speed, power consumption, dynamic range and image quality
• Design, simulate and verify critical analog and mixed-signal circuit blocks
• Lead circuit and layout reviews, make technical decisions and drive tape-out sign-off
• Guide internal engineers and technically steer external design and test partners
• Define and execute IC verification and post-silicon validation plans, including lab characterisation
• Improve design methodologies, tool flows and technical ways of working
• Help build and mentor a growing ROIC Design Team

What you bring

• Master’s or PhD in Electronics, Microelectronics or a related discipline
• Extensive hands-on experience in analog and mixed-signal IC design, ideally 10+ years
• Proven experience in imaging: ideally ROICs, CMOS image sensors, infrared imaging, SPAD/ToF or closely related sensor-readout applications
• A proven track record of owning the full ROIC or image-sensor architecture of completed chip developments – from the initial readout concept and circuit specifications through tape-out and silicon validation
• Strong technical judgement and the ability to make architecture-level design trade-offs
• Experience reviewing circuit design and IC layout, while understanding the distinct responsibilities of each discipline
• Experience with Cadence and/or Siemens EDA environments
• Professional proficiency in English

What we offer

• A highly technical, high-impact role in a fast-growing advanced imaging company
• The chance to work on sophisticated infrared camera technology for demanding real-world applications
• Direct ownership of chip architecture and genuine influence on future products and engineering capability
• A collaborative international R&D environment with experts across sensors, IC design, layout, optics and camera systems

Interested? Please apply with via EasyApply. We will review your application and contact you by email should your experience match the requirements of this role.

Please note: Due to the high volume of applications we receive, we are unfortunately unable to provide individual feedback to every applicant.