Role description
You will own the mechanical design of a new semiconductor thin-film deposition platform. You will be responsible for turning the prototype of a vacuum chamber into a fab-ready ion- and plasma-based deposition system. You will take the lead on vacuum and thermal architecture, ion/plasma source mechanical integration, precision assemblies for the target, and substrate-handling systems with thermal control and motion.
You will be responsible for defining the chamber layout, materials, interfaces, pumping strategy, and access requirements needed to support plasma operation, process stability, and diagnostics. You will work hand-in-hand with the CTO, Plasma Engineers, and Materials Engineers to drive full-system decisions.
This position is in an early-stage startup environment. You should be ready for ambiguity, tight schedules, shifting priorities, rapid iteration, working directly alongside the CTO, and assuming wider responsibility for decisions that shape the final product-market fit.
Visa: Visa sponsorship is available
Equity: ESOP available, will be discussed individually
Work arrangement: 4 days on-site, 1 day hybrid
Work location: Eindhoven (High Tech Campus)
Salary range: €85k to €115k gross per year
Responsibilities
Main requirements
Other requirements
Nice to have, but not mandatory
Benefits
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