For nearly five decades, ZIN Technologies (ZIN) has provided integrated products and spaceflight hardware development services to NASA and Fortune 500 companies. ZIN specializes in the seamless and transparent progression between concept, detailed design, engineering, manufacturing, and operations. ZIN, with its uniquely qualified staff, and a proven track record of award winning work, delivers product development, system prototypes, and space flight hardware on time and under budget. ZIN has over 150 scientists, engineers, and technicians engaged in the development of specialized data acquisition and control systems, power converters, and optical-mechanical sy stems for aerospace and commercial applications. ZIN experience base includes competitively awarded engineering contracts from both government and commercial companies. Our scope of experience includes scientific, technical, operational, and program management, as well as the disciplines associated with large, complex space programs. ZIN Associates are talented, experienced individuals; many have advanced degrees and professional certifications that provide a wealth of knowledge and capabilities to our customers. Operating as a team, we are dedicated to supplying innovative, cost effective services and solutions. TO BE CONSIDERED, APPLY AT www.zin-tech.com/careers Conduct thermal analysis on a variety of system and component level items using FEMAP Thermal and FEMAP Flow (MAYA TMG Solver) based FEA modeling per NASA and/or Aerospace accepted standards. Work with project engineers to develop thermal models of hardware design and be able to intrepret analysis results for design modification and/or identify area of interest to verify by testing. Validate thermal models using simple experimental set-ups. Generate reports to capture analytical and practical model validation. Support thermal testing including developing thermal test plan, conducting test, and reporting results. U.S. CITIZENSHIP REQUIRED POSSIBLE RELOCATION ASSISTANCE Bachelors of Mechanical or Aerospace Engineering with 3-5 years experience with emphasis on thermal modeling and heat transfer/thermal experimentation. Candidate should be comfortable using FEMAP pre/post finite element modeling software or equivalent and be able to use hand calculation to develop modeling parameters such as thermal interface conductivities/resistances, orthotropic PCB conductivities, and component junction temperatures. Experience using FEMAP is required. In addition to competitive salaries, ZIN offers excellent benefits to our associates, including medical, vision, and dental insurance; short- and long-term disability; life insurance; paid leave and paid holidays; 401(k) retirement plan (immediate vesting); education and training reimbursement; professional development opportunities; employee assistance program; flexible spending plans; credit union membership; and direct deposit. ZIN-Technologies, Inc. is an Equal Employment Opportunity Employer M/F/D/V
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