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R&D Principal Engineer for Novel Materials and Integration Solutions (7997)

Salary
$130K–$180K
Hiring from
United States
Work type
Hybrid
Posted

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About the Role

Join our Corporate Research team in San Jose as an R&D Principal Engineer focused on developing novel materials and integration solutions for advanced semiconductor devices and 3D structures. In this role, you will work hands-on across materials synthesis, thin-film deposition, cleanroom fabrication, and advanced characterization to support next-generation IC technologies. You will collaborate with internal teams in San Jose and Taiwan, as well as university research partners, to explore new materials, devices, and thermal integration approaches for future semiconductor innovation.

You will join us in our San Jose office, operating on a hybrid work schedule with 4 days in-office.

Responsibilities

  • Research and develop novel materials and integration solutions for future devices and IC thermal management applications.
  • Synthesize and deposit materials using CVD, ALD, PVD, and related techniques.
  • Fabricate devices and test structures using cleanroom processes such as lithography, etching, deposition, metallization, and bonding.
  • Characterize materials, interfaces, and devices using structural, chemical, electrical, optical, and thermal analysis methods.
  • Analyze experimental data and prepare technical reports.
  • Collaborate with internal cross-functional teams and external research partners.
  • Conduct research at both in-house and off-site facilities.

Minimum Qualifications

  • Ph.D. in Physics, Materials Science, Chemistry, Electrical Engineering, or a related field.
  • Experience in materials synthesis and thin-film deposition using CVD, ALD, PVD, or related growth methods.
  • Hands-on experience with cleanroom processing, device fabrication, and characterization techniques.
  • Strong knowledge of materials science, surface chemistry, thin-film growth, etching, planarization, and bonding.
  • Ability to work independently and collaborate with cross-functional teams.

Preferred Qualifications

  • Experience in semiconductor device design, fabrication, integration, and advanced testing.
  • Experience with thermal characterization of materials, structures, or interfaces.
  • Experience setting up research equipment or programming for tool control and data collection.
  • Experience in data analysis and technical reporting.
  • Familiarity with physics-based simulation tools.

Company Description

Join TSMC Technology, Inc. (TTI), an innovation hub of Taiwan Semiconductor Manufacturing Company Limited (TSMC). TSMC has been a pioneer in the semiconductor industry since 1987. With teams located in San Jose, CA, and Austin, TX, TTI is dedicated to advancing semiconductor technology through expertise in physical design, memory design, analog mixed signal, power management, and groundbreaking computational AI machine learning research. Our mission is to drive the future of semiconductor innovation through unparalleled R&D and customer-focused IP. Be part of a team that shapes the next generation of technological advancements.

As a trusted technology and capacity provider, TSMC is driven by the desire to be:

  1. The world’s leading dedicated semiconductor foundry
  2. The technology leader with a strong reputation for manufacturing excellence
  3. Advancing semiconductor manufacturing innovations to enable the future of technology

TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and a portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.

In North America, TSMC has a strong sales and service organization that works with customers by helping them achieve silicon success with cutting-edge technologies and manufacturing excellence. The Company has continued to accelerate its R&D investment and staffing in recent years and is expanding its manufacturing footprint to support customer innovation with 3D IC technologies and optimal manufacturing capacity.

For positions requiring access to technical data subject to export control regulations, including Export Administration Regulations, TSMC North America may have to obtain export licensing approval from the U.S. Government for certain individuals. All employment is contingent upon TSMC North America obtaining any export license or other approval that may be required by the U.S. Government.

TSMC Core Values

At TSMC, we invite talented individuals who share our vision and values to contribute to our continued success. Our core values are the foundation of our culture, guiding every decision and action. We seek applicants who deeply resonate with these principles and embody them in their work:

  • Integrity: Tell the truth. We do not brag. We do not make commitments lightly. Once we make a commitment, we devote ourselves completely to meeting that commitment.
  • Commitment: Employees are dedicated to the company, view the company’s success as their own and work diligently to make their best contributions. As commitment is mutual, the Company strives to serve the best interests of its employees.
  • Innovation: Innovation is the wellspring of the Company's growth. It means more than new ideas; it means putting ideas into practice.
  • Customer Trust: We strive to build deep and enduring relationships with our customers, who trust and rely on us to be part of their success over the long term.

(For more details on TSMC’s Core Values, please visit:https://www.tsmc.com/english/aboutTSMC/values)

Diversity statement

TSMC Technology, Inc. is committed to employing a diverse workforce and provides Equal Employment Opportunity for all individuals regardless of race, color, religion, gender, age, national origin, marital status, sexual orientation, gender identity, status as a protected veteran, genetic information, or any other characteristic protected by applicable law.

TSMC is an equal opportunity employer prizing diversity and inclusion. We are committed to treating all employees and applicants for employment with respect and dignity. If you require reasonable accommodation due to a disability during the application or the recruiting process, please feel free to notify us at g_accommodations@tsmc.com. TSMC confirms to all applicants its commitment to meet TSMC’s obligations under applicable employment law. Reasonable accommodations will be determined on a case-by-case basis.

Pay Transparency / Benefits statement

At TSMC, your base pay is only part of your overall total compensation package. At the time of this posting, this role typically pays a base salary between $130,000 and $180,000 per year. The range displayed reflects the minimum and maximum target for new hires. Actual pay may be more or less than the posted range. Factors that influence pay include the individual's skills, qualifications, education, experience and the position level and location. TSMC’s total compensation package consists of market competitive pay, allowances, bonuses, and comprehensive benefits. We also offer extensive development opportunities and programs.

Date: Oct 22, 2026
Country/Region: US
City: San Jose
Company: TSMC Technology, Inc.


Nearest Major Market: San Jose
Nearest Secondary Market: Palo Alto

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