Senior Process Integration Engineer
- Hiring from
- United States
- Work type
- Hybrid
- Posted
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- Responsibilities
- Drive new product and new process development to ensure timely and successful delivery of qualified products.
- Oversee day-to-day progress of matrix lots to keep development activities on track.
- Manage part numbers and BOM to ensure proper setup for new product introduction.
- Support the NPI team in establishing mask sets, process flows, and workflows for both front-end (wafer fabrication) and back-end (die assembly and characterization) processes.
- Assist in failure analysis by investigating issues found during wafer fabrication and product characterization and take the lead in analyzing root causes.
- Coordinate production ramp-up readiness by working closely with cross-functional teams—including EPI, process, assembly, test, and product engineering—to ensure readiness in areas such as chip design/specs, equipment, process documentation, and data infrastructure.
- Collaborate with the product engineering team to improve yield, especially in addressing characterization issues that span multiple process areas.
- Design and execute experiments related to design, process, and testing to identify and implement corrective actions for failure modes encountered during new product development.
- Experience
- 3 years of experience in III-V semiconductor laser related device design, process
development and characterization is required. - PhD degree in electrical engineering, material science, physics, or other relevant
major.
- 3 years of experience in III-V semiconductor laser related device design, process
- Skills & requirements
- Hands-on experience with design, process and characterization of optoelectronic device such as VCSEL, DFB laser, or photonic integrated chip.
- Strong statistical data analysis skills (JMP or Minitab etc.).
- Familiarity with semiconductor wafer fab operations (Manufacturing Execution System, process and quality control, change management etc.).
- Experience with optoelectronic device reliability testing and modeling is a plus.
- Strong communication skills; adept at hosting effective meetings and facilitating actions and resolving conflicts.
- Strong ability to drive actions and solutions through cross-functional teams.
- Collaborate in a professional and respectful manner with coworkers, vendors, contractors, etc.
- Oversee new product and process development, ensuring timely qualification and launch.
- Manage day-to-day progress of development activities, keeping projects on track.
- Support NPI team in establishing mask sets, process flows, and workflows for front-end and back-end processes.
- Lead failure analysis, investigating issues during fabrication and characterization.
- Coordinate production ramp-up with cross-functional teams, ensuring readiness in all areas.
- Collaborate with product engineering to improve yield and address characterization issues.
- Design and execute experiments to identify and correct failure modes.
- Manage part numbers and BOM for new product introductions.
- Ensure proper setup and documentation for smooth transition to manufacturing.
- PhD in Electrical Engineering, Material Science, Physics, or related field.
- 3+ years of experience in III-V semiconductor laser device design, process development, and characterization.
- Hands-on experience with optoelectronic device design, process, and characterization (VCSEL, DFB laser, etc.).
- Strong statistical data analysis skills (JMP, Minitab, etc.).
- Familiarity with semiconductor wafer fab operations and processes.
- Experience with optoelectronic device reliability testing is an asset.
- Excellent communication skills, able to lead meetings and resolve conflicts.
- Proven ability to drive cross-functional teams and actions.
- Professional and respectful collaboration with colleagues and external partners.
- Ability to work in a cleanroom environment and with hazardous materials.
