Solutions Engineer - AE

At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.

Solutions Architect Engineer (AE)

Advanced Packaging, 3D-IC and SI/PI

Location

United States (Remote or Hybrid)

Job Summary

Cadence is seeking a highly motivated and experienced Solutions Application Engineer to support customers developing next-generation advanced packaging solutions, including 2.5D, 3D-IC, chiplet-based architectures, AI/HPC packages, and heterogeneous integration technologies.

The successful candidate will work directly with leading semiconductor companies, OSATs, foundries, and system companies to deploy and optimize Cadence Advanced Package 3D-IC associated design flows. This role combines technical expertise, customer engagement, solution development, and collaboration with R&D to drive customer success and product adoption.

Responsibilities

• Provide technical leadership and application support for Cadence 3D-IC design solutions.
• Assist customers with advanced package architecture, design implementation, and methodology development.
• Develop and demonstrate complete packaging workflows for:
  • Organic substrates
  • Silicon interposers
  • Wafer Level Packaging
  • 2.5D and 3D-IC integration
  • Chiplet-based package architectures
• Support customer evaluations, proof-of-concepts, benchmarks, and production deployments.
• Deliver technical presentations, product demonstrations, workshops, and training sessions.
• Collaborate with sales teams to identify opportunities and provide technical pre-sales support.
• Work closely with R&D to communicate customer requirements, enhancement requests, and new technology needs.
• Support design-signoff methodologies including:
  • DRC/LVS
  • Connectivity verification
  • Electrical rule checking
  • Thermal analysis
  • Signal Integrity (SI)
  • Power Integrity (PI)
• Develop best practices, application notes, reference flows, and customer success methodologies.
• Assist in defining future product direction for advanced packaging, 3D-IC, and chiplet technologies.

Required Qualifications

• Bachelor’s degree (Masters preferred) in Electrical or Electronics Engineering, or related discipline with
• 10+ years of experience in semiconductor packaging, IC packaging, PCB, substrate, or interposer design.
• Strong knowledge of:
  • Advanced package design methodologies
  • 2.5D and 3D-IC integration
  • Chiplet-based architectures
  • Package manufacturing and assembly processes
  • High-speed signal design
  • Power delivery networks
• Experience performing package layout, routing, constraint management, and package signoff.
• Solid understanding of package stackups, bump planning, escape routing, and substrate technologies.
• Excellent customer-facing communication and presentation skills.
• Ability to work independently while collaborating across global teams.

Preferred Qualifications

• Experience with Cadence Integrity 3D-IC Platform.
• Experience with Cadence Sigrity and Clarity 3D Solver.
• Hands-on experience with Cadence Allegro X APD.
• Knowledge of UCIe, HBM, AI accelerator packaging, and heterogeneous integration.
• Experience supporting foundry and OSAT design flows.
• Understanding of semiconductor assembly, reliability, and manufacturing processes.

Travel Expectations: Approximately 2% to 5% travel, depending on customer demand and business needs.

The annual salary range for California is $162,400 to $301,600. You may also be eligible to receive incentive compensation: bonus, equity, and benefits. Sales positions generally offer a competitive On Target Earnings (OTE) incentive compensation structure. Please note that the salary range is a guideline and compensation may vary based on factors such as qualifications, skill level, competencies and work location. Our benefits programs include: paid vacation and paid holidays, 401(k) plan with employer match, employee stock purchase plan, a variety of medical, dental and vision plan options, and more.

We’re doing work that matters. Help us solve what others can’t.

About Us

Additional Jobs

Equal Employment Opportunity Policy:

Cadence is committed to equal employment opportunity throughout all levels of the organization.

• Read the policy(opens in a new tab)

We welcome your interest in the company and want to make sure our job site is accessible to all. If you experience difficulty using this site or to request a reasonable accommodation, please contact staffing@cadence.com.

Privacy Policy:

Job Applicant If you are a job seeker creating a profile using our careers website, please see the privacy policy(opens in a new tab).

E-Verify Cadence participates in the

E-Verify program in certain U.S. locations as required by law. Download More Information on E-Verify (64K)

Cadence plays a critical role in creating the technologies that modern life depends on. We are a global electronic design automation company, providing software, hardware, and intellectual property to design advanced semiconductor chips that enable our customers create revolutionary products and experiences.

Thanks to the outstanding caliber of the Cadence team and the empowering culture that we have cultivated for over 25 years, Cadence continues to be recognized by Fortune Magazine as one of the 100 Best Companies to Work For. 
Our shared passion for solving the world’s toughest technical challenges, our dedication to pushing the limits of the industry, and our drive to do meaningful work differentiates the people of Cadence.

Cadence is proud to be an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, sex, age, national origin, religion, sexual orientation, gender identity, status as a veteran, basis of disability, or any other protected class.