In your career, let’s prove what’s possible.

At Lam Research, we create equipment that drives technological advancements in the semiconductor industry. Our innovative solutions enable chipmakers to power progress in nearly all aspects of modern life, and it takes each member of our team to make it possible.

Across our organization, our employees come to work and change the world. We take on the toughest challenges with precision and accuracy. We push for the next big semiconductor breakthrough. We lead the way in one of the most critical and fast-moving industries on the planet. And we do it together, with deep connections and limitless collaboration.

The impact we have on the world is made possible by focusing on our people. So we recognize and celebrate our teams’ achievements. We strive to create an inclusive and diverse culture where everyone’s contribution and voice has value. We evaluate and evolve our offerings, so our people receive the support and empowerment to do meaningful things for their lives, careers, and communities.

Because at Lam, we believe that when people are the priority and they’re inspired to unleash the power of innovation for a better world together, anything is possible.

Date: Oct 16, 2026

Location:

Req ID: 203887

Worker Category: On-site Flex

The group you’ll be a part of

The Advanced Packaging Integration Group focuses on driving differentiated solutions from Lam to enable customer heterogeneous integration product and process roadmaps through orchestration of joint projects and integrated test vehicles with ecosystem partners, including research institutes, consortia, universities, and peer companies. The Technology and Ecosystem Engagements Group enables a virtual integration center for Lam product groups and customer engagement teams to drive accelerated studies to understand and resolve challenging process integration problems and deliver unique and effective product solutions to meet future customer roadmaps.

The impact you’ll make

You will directly contribute to expanding Lam Research's Advanced Packaging technology leadership and industry influence by leading and executing complex JDPs and research programs that create measurable business value across engineering, manufacturing, supply chain, and business operations. You will partner with engineers and leaders across multiple product groups and customer account teams across Lam as well as external ecosystem leaders to orchestrate a virtual integration center that enhances faster decision-making, operational efficiency, innovation, and extends Lam's competitive advantage. You will also represent Lam Research as a technology ambassador at industry conferences and symposiums enhancing our vision and strategy of advancing technology through strong ecosystem collaborations.

What you’ll do

Build and lead a collaborative innovation ecosystem across materials suppliers, substrate vendors, OSATs, foundries, consortia, peer companies, universities, and research institutions.
Anticipate, define and lead JDPs relevant to technology inflections across AI/HPC/memory and future advanced system architectures with ecosystem partners to shape industry direction and standards - Define scope, objectives, success metrics, milestones and negotiate agreements.
Own success of JDPs and collaborations so program schedules and performance metrics are met.
Review program schedules and performance metrics with regional experts.
Maintain the pipeline of ecosystem capabilities and opportunities with regional experts.
Ensure learnings are captured, documented, disseminated effectively, and well-leveraged across the organization.
Support and deliver test vehicle needs of internal stakeholders across GPG, GCO and other groups.
Initiate and drive multi-party collaborations across the 30+ partner network.
Represent Lam at industry conferences and symposiums to expand network, influence, and branding.
Support mentoring and recruitment for the ecosystem team.

Who we’re looking for

Master's or PhD in Engineering (electrical/mechanical/chemical), Materials Science, Applied Physics, Chemistry, or a related discipline.
10+ years of experience in process development, packaging integration, model-based problem solving, program management, or related business functions within a complex enterprise environment.
Strong understanding of advanced packaging technologies and integration, industry direction, and research initiatives.
Demonstrated experience partnering with senior executives and business stakeholders to define strategy, prioritize investments, and deliver business outcomes.
Experience managing cross-functional programs and influencing stakeholders in a global, matrixed organization.

Preferred qualifications

Experience with initiation, definition, and execution of joint development projects with research institutes, industry consortia, and academic institutions.
Proven experience building and leading cross-functional or exploratory R&D or technology pathfinding teams, driving innovation strategy and execution.
Semiconductor, capital equipment, industrial technology, or advanced manufacturing industry experience.
Strong network across the industry ecosystem and research communities.
Highly effective in ambiguous situations, capable of making high-impact decisions with incomplete data to ensure programs stay on track and schedule.

Our commitment

We believe it is important for every person to feel valued, included, and empowered to achieve their full potential. By bringing unique individuals and viewpoints together, we achieve extraordinary results.

Lam Research ("Lam" or the "Company") is an equal opportunity employer. Lam is committed to and reaffirms support of equal opportunity in employment and non-discrimination in employment policies, practices and procedures on the basis of race, religious creed, color, national origin, ancestry, physical disability, mental disability, medical condition, genetic information, marital status, sex (including pregnancy, childbirth and related medical conditions), gender, gender identity, gender expression, age, sexual orientation, or military and veteran status or any other category protected by applicable federal, state, or local laws. It is the Company's intention to comply with all applicable laws and regulations. Company policy prohibits unlawful discrimination against applicants or employees.

Lam offers a variety of work location models based on the needs of each role. Our hybrid roles combine the benefits of on-site collaboration with colleagues and the flexibility to work remotely and fall into two categories – On-site Flex and Virtual Flex. ‘On-site Flex’ you’ll work 3+ days per week on-site at a Lam or customer/supplier location, with the opportunity to work remotely for the balance of the week. ‘Virtual Flex’ you’ll work 1-2 days per week on-site at a Lam or customer/supplier location, and remotely the rest of the time.

Our Perks and Benefits

At Lam, our people make amazing things possible. That’s why we invest in you throughout the phases of your life with a comprehensive set of outstanding benefits.

Discover more at Lam Benefits

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Sr. Mgr, Package Engineering