Firmware Engineer
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Position: Firmware Engineer
Location: Dallas, USA - OnsiteDuration: Long termExperience: 8+ years
Visa: OPT-EAD, H1B, TN, L2-EAD, -EAD & USC
Job Description
Key skills - OCP DC-SCM/DC-MHS, USB
OBMF-ICP Protocol Stack: Design, implement, and maintain the OBMF-ICP protocol stack and core protocol components.
Transport Bindings: Develop and integrate OBMF-ICP transport bindings over USB and MCTP.
Hardware Bring-up: Lead end-to-end hardware bring-up, including board validation, interface debugging, and firmware readiness.
OCP Collaboration: Represent the program in OCP working-group discussions, reviews, and technical alignment activities.
Technical Leadership: Drive architecture, resolve cross-layer issues, and establish implementation and validation best practices.
Expert in embedded C, strong C++
BMC / Platform-management Firmware Experience (Open BMC Strongly Preferred)
DMTF MCTP and PLDM (incl. PLDM firmware update); working knowledge of SPDM
Hands-on USB, I2C/SMBus, I3C, SPI, UART, GPIO; logic/protocol analyzers, JTAG/SWD
RTOS (Zephyr/FreeRTOS) and/or embedded Linux on Arm Cortex-M / RISC-V
Yocto/BitBake, CMake/Meson, Git, CI
Understanding of I2C/SMBus, SPI, UART, USB, GPIO
Basic hands-on with logic analyzers, oscilloscopes, JTAG/SWD; can read datasheets and schematics. Know anyone who might be interested?
Kindly let me know if you have any Suitable Candidates available for this opportunity.
+1
Location: Dallas, USA - OnsiteDuration: Long termExperience: 8+ years
Visa: OPT-EAD, H1B, TN, L2-EAD, -EAD & USC
Job Description
Key skills - OCP DC-SCM/DC-MHS, USB
OBMF-ICP Protocol Stack: Design, implement, and maintain the OBMF-ICP protocol stack and core protocol components.
Transport Bindings: Develop and integrate OBMF-ICP transport bindings over USB and MCTP.
Hardware Bring-up: Lead end-to-end hardware bring-up, including board validation, interface debugging, and firmware readiness.
OCP Collaboration: Represent the program in OCP working-group discussions, reviews, and technical alignment activities.
Technical Leadership: Drive architecture, resolve cross-layer issues, and establish implementation and validation best practices.
Expert in embedded C, strong C++
BMC / Platform-management Firmware Experience (Open BMC Strongly Preferred)
DMTF MCTP and PLDM (incl. PLDM firmware update); working knowledge of SPDM
Hands-on USB, I2C/SMBus, I3C, SPI, UART, GPIO; logic/protocol analyzers, JTAG/SWD
RTOS (Zephyr/FreeRTOS) and/or embedded Linux on Arm Cortex-M / RISC-V
Yocto/BitBake, CMake/Meson, Git, CI
Understanding of I2C/SMBus, SPI, UART, USB, GPIO
Basic hands-on with logic analyzers, oscilloscopes, JTAG/SWD; can read datasheets and schematics. Know anyone who might be interested?
Kindly let me know if you have any Suitable Candidates available for this opportunity.
+1
