Job Description The Junior Thermal Research Engineer will work within a multidisciplinary engineering team to develop innovative thermal management and test solutions for high-performance electronics and data center systems. The role combines thermal system design, modeling, experimentation, and data science techniques, with a focus on enabling faster design cycles and improved system-level insight. Primary Responsibilities: Support the design and development of thermal management systems, including liquid cooling, two-phase cooling, and heat exchanger-based architectures Cooling system design including cold plates, cooling distribution units (CDUs) and passive two-phase solutions (heat pipes and vapor chambers) Develop and apply thermal-fluid modeling tools (steady-state and transient) for system-level performance prediction, including pressure drop, heat transfer, and coolant distribution Implement and use machine learning, AI and data-driven methods Support data center cooling system modeling, including rack-level and component-level thermal architecture analysis Conduct design of experiments (DOE) and support experimental testing, including instrumentation, data acquisition, and validation of models Create and maintain CAD models and engineering documentation (e.g., SolidWorks designs, P&IDs, drawings, and test plans) Assist in development of computational tools and simulation frameworks (Python, MATLAB) to support engineering decision-making and research activities Support prototype development and testbed construction, including integration of thermal systems and measurement capabilities Collaborate with senior engineers and researchers to: Evaluate new cooling technologies Improve system efficiency and performance Identify key design tradeoffs Contribute to technical documentation, reports, and presentations of results Support component and material selection for thermal systems (heat exchangers, sensors, cooling loops) Assist in manufacturing and assembly support, including prototype builds and testing Basic Qualifications Master’s or PhD degree in Mechanical Engineering or related field Eaton will not consider applicants for employment immigration sponsorship or support for this position. This means that Eaton will not support any CPT, OPT, or STEM OPT plans, F-1 to H-1B, H-1B cap registration, O-1, E-3, TN status, I-485 job portability, etc. Relocation may be offered for the role, must be currently located in the United States. Preferred Experience: Exposure to data center cooling or high-performance electronics thermal management Experience developing reduced-order or surrogate models for thermal systems Familiarity with optimization-driven design workflows Experience integrating modeling and experimental validation Focus or coursework in heat transfer, fluid dynamics, or thermal systems required Laboratory experience Graduate research experience in thermal-fluid sciences or cooling technologies strongly preferred #LI-AH1 All Job Posting Locations Fredericksburg Remote Type On-Site EEO Statement Boyd Corp is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees.
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