Semiconductor Experts (Principal / Fellow-Lv. in Memory, HBM, Advanced Packaging & AI Systems)

Principal / Fellow-Level Semiconductor Experts

(Memory, HBM, Advanced Packaging & AI Systems) - Korea or Japan

About the Opportunity

A leading global technology company is expanding its advanced semiconductor R&D organization in Japan and is seeking world-class technical experts to help shape the future of AI infrastructure, memory systems, semiconductor architecture, storage technologies, and advanced packaging.

We are looking for accomplished technical leaders, Principal Engineers, Architects, Fellows, Distinguished Engineers, and Subject Matter Experts from leading semiconductor and technology companies.

Professionals from Samsung Electronics, SK hynix, Micron, Kioxia, Western Digital, Intel, AMD, NVIDIA, Broadcom, Marvell and other leading semiconductor companies are highly encouraged to apply.

Why Join Us

• Contribute to next-generation AI, HPC, and data center technologies
• Influence long-term technology strategy and product roadmaps
• Collaborate with globally recognized semiconductor scientists and architects
• Significant technical ownership and decision-making authority
• Japan-based global R&D environment
• Highly competitive compensation package
• Relocation support available
• Consultant / Advisor opportunities available for distinguished experts

Key Responsibilities

• Research and develop next-generation semiconductor, memory, and storage technologies
• Drive architecture design, system optimization, and technical innovation
• Lead technical reviews and engineering problem-solving activities
• Define future technology roadmaps and strategic directions
• Analyze product reliability and perform advanced failure analysis
• Support AI infrastructure, HPC, and data center platform development
• Collaborate with global R&D teams on technology development and commercialization

We are particularly interested in experts with backgrounds in:

# Memory & HBM

• DRAM / DDR / LPDDR / GDDR / HBM
• Memory Architecture and Memory Controller Design
• Memory Performance Optimization and Memory Subsystem Design

# Product Engineering & Yield

• DRAM, HBM and/or NAND Product Engineering
• Yield Enhancement and Process Integration
• Product Qualification and KGD Testing

# Reliability & Failure Analysis

• Reliability Engineering, Failure Analysis (FA) and Root Cause Analysis (RCA)
• ECC, RAS, Fault Tolerance and Package Reliability
• Customer Quality Engineering and Field Failure Analysis

# Advanced Packaging

• TSV, Hybrid Bonding, TCB
• 2.5D / 3D Packaging and Heterogeneous Integration
• Advanced Assembly Technologies

# Storage Technologies

• SSD Architecture, HDD Reliability, Tribology, Surface Science
• Storage Systems and Data Center Storage Solutions

# Semiconductor Design

• ASIC, SoC, CPU, GPU and DPU
• AI Accelerator, Digital IC Design
• RTL Design and Verification

Qualifications

• Bachelor's, Master's or Ph.D. in Electrical Engineering, Computer Engineering, Materials Science, Physics, Mechanical Engineering or related disciplines
• 8+ years of relevant industry experience
• Proven expertise in one or more of the technical domains listed above
• Demonstrated track record of innovation, technology leadership, or technical influence
• Language: English (nice to have: Japanese, Chinese)

Contact

JaeYoung Kwon - Senior Consultant, JAC Recruitment Korea

Email: jaeyoung.kwon@jac-recruitment.com

Web: jac-recruitment.kr