Join our photonics team and work at the forefront of microLED and optical interconnect technology. As our Thermal Simulation & Modelling Engineer, you will own the thermal behaviour of our microLED-on-CMOS devices in COMSOL Multiphysics.

You will model heat flow from the microLED, through the bond, into the CMOS backplane and package. Your results will directly shape device design, CMOS layout and process choices. There will be an opportunity to also be part of other R&D activities depending on your background and interests such as simulating etch processes and microlenses & Packaging.

Key Responsibilities

Build COMSOL thermal models of the full stack: microLED, bond, CMOS backplane and package.
Model pixel self-heating, bond thermal resistance and hot spots, and their impact on efficiency, wavelength and lifetime.
Simulate CMOS power dissipation and feed thermal limits into layout and electro-thermal co-simulation.
Run parametric studies to guide pixel pitch, drive scheme, bonding and materials.
Simulate etch processes and microlens designs to support device and optical design.
Validate models against measured data and turn results into clear design rules.

Skills, Knowledge and Expertise

Degree in Physics or Electronic Engineering. A PhD or MSc is an advantage.
Proven hands-on thermal simulation in COMSOL Multiphysics.
Strong heat-transfer fundamentals: conduction, interface resistance and transient behaviour.
Expertise within semiconductor devices and CMOS circuits.
Track record of validating models against experimental data.
Clear communication of technical results.

Advantage

Experience with LEDs, microLEDs or GaN optoelectronic devices.
Photonic packaging experience, such as optical interconnect, to support wider team activities.
VCSEL expertise.

Benefits

Pension scheme
Private medical & dental insurance
28 days’ holiday + bank holidays
Free onsite meals
Onsite gym
Relocation support
Visa support available

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