PCB Layout Engineer

PCB Layout Engineer

Location: Mountain View, CA

Onsite

About the Role

An innovative AI hardware startup is seeking an experienced PCB Layout Engineer to own the physical design of high-performance, high-speed, and high-power circuit boards for next-generation AI accelerator systems.

This role offers end-to-end ownership of board-level layout, from stackup definition and component placement through high-speed routing, power delivery, and fabrication release.

You'll collaborate closely with signal integrity, power integrity, packaging, and hardware engineering teams to ensure complex board designs meet electrical and manufacturing requirements.

Key Responsibilities

• Own end-to-end PCB layout for advanced AI accelerator systems, including stackup definition, impedance control, component placement, high-speed routing, and fabrication release.
• Design and optimize high-current power delivery layouts for accelerator hardware.
• Perform complex BGA escape routing for large, fine-pitch accelerator packages.
• Implement high-speed layout constraints, including length and skew matching, return-path management, crosstalk mitigation, and via optimization.
• Collaborate with SI/PI, packaging, and hardware systems teams to ensure electrical performance across package-to-board interfaces.
• Drive design for manufacturability and assembly (DFM/DFA) with PCB fabrication and contract manufacturing partners.
• Support board bring-up, debugging, and resolution of layout-related electrical issues.
• Develop and leverage AI-assisted design tools to accelerate layout, design reviews, and design-rule checking.

Required Qualifications

• 8+ years of professional PCB layout experience, ideally involving server, networking, HPC, or AI accelerator hardware.
• Strong expertise in complex, high-layer-count PCB designs with high-speed signaling and high-current power delivery.
• Advanced knowledge of controlled impedance, stackup definition, return-path design, crosstalk management, and signal integrity constraints.
• Experience with fine-pitch BGA escape routing, length/skew matching, and via optimization.
• Proficiency with industry-standard PCB layout tools such as Cadence Allegro, Siemens Xpedition, Altium Designer, or equivalent.
• Experience preparing manufacturing release packages using Gerber, ODB++, IPC-2581, or equivalent formats.
• Demonstrated ability to collaborate with SI/PI, packaging, and hardware engineering teams to implement and close complex electrical constraints.

Preferred Qualifications

• Experience with advanced packaging technologies, including 2.5D/3D integration, CoWoS, EMIB, chiplets, or HBM interfaces.
• Background in high-performance computing, GPUs, AI accelerators, or hyperscale server hardware.
• Experience with rigid-flex PCB or high-speed backplane design.
• Knowledge of PCB CAD automation and scripting.
• IPC CID or CID+ certification.
• Experience managing overseas PCB fabrication and assembly partners.

Final compensation will depend on experience, technical expertise, and role level.

Additional Information

The employer welcomes qualified candidates requiring employment-based visa sponsorship or transfer, including eligible H-1B, O-1, TN, E-3, F-1 OPT, and STEM OPT candidates, subject to applicable requirements.

Certain responsibilities may involve technologies subject to U.S. export control regulations (EAR/ITAR).

The employer is committed to equal employment opportunities and providing reasonable accommodations throughout the hiring process.